E Ink announced it is collaborating with Realtek Semiconductor, Integrated Solutions Technology (IST), and Chipbond Technology to develop the System on Panel (SoP) architecture, to be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM.
SOLUM is the number one US ESL solution provider, and the project's aim is to simplify the material structure of ESL and bring a sustainable solution via reduced material usage, lower power consumption and simplified production processes.
Posted: Apr 15,2024 by Ron Mertens